| Grade Category | Common Brands / Specs | Detailed Characteristics | Ideal Applications |
| POM-C (Acetal Copolymer) | Ultraform®, Celcon®, Tecaform® | High resistance to hydrolysis (hot water up to 80°C) and strong alkalis. Free from "centerline porosity" issues common in homopolymers. More thermally stable during machining.Porosity: Porosity-free. | Food contact parts, plumbing components, chemical pump housings, bushings in wet environments. |
| POM-H (Acetal Homopolymer) | DuPont™ Delrin® 150, Delrin® 100 | Higher tensile strength, stiffness, and hardness than Copolymer. Better fatigue resistance. However, thick sections may contain centerline porosity (voids) due to the manufacturing process.Stiffness: ~15% stiffer than POM-C. | High-load precision gears, thin-walled parts, springs, snap-fit assemblies, zippers. |
| PTFE-Filled POM | Delrin® AF Blend | POM blended with PTFE (Teflon) fibers. Drastically reduces the coefficient of friction and eliminates "stick-slip" behavior. Slightly lower mechanical strength than unfilled POM.<br>Friction: Ultra-low. | High-speed sliding bearings, guide rails, linear motion components, valve seats. |
| Glass-Filled POM | POM-GF25 (25% Glass) | POM blended with PTFE (Teflon) fibers. Drastically reduces the coefficient of friction and eliminates "stick-slip" behavior. Slightly lower mechanical strength than unfilled POM.Friction: Ultra-low. | Structural components under high static load, dimensionally critical housings. |
| ESD / Static Dissipative POM | Semitron® ESD 225 | Reinforced with glass fibers for significantly enhanced stiffness, tensile strength, and creep resistance. Reduced thermal expansion.Machining: Abrasive to tools. | Electronic fixture nests, disk drive components, semiconductor handling parts. |